Production / Special manufacturing equipment and technical facilities
Fabrication
Clean room facilities
- Chip mounter (for mounting semi-conductor chips)
- Multi probe test fixture station and microscope for testing
- 2 semi-automatic wire-bonding machines for Ball/Wedge bonding with
gold-wire or Wedge/Wedge bonding with platinum- or aluminum-wire
- 2 automatic Ball/Wedge- and Wedge/Wedge- bonding machines;
with or without temperature regulation for bonding circuit boards
up to a maximum size of 6" x 6" (15 x 15 cm)
Precision engineering and prototype workshop
- Diverse machanical ancillary and specially designed tools
- Turning lathe, milling machine and drill machine
- Assembly area
