Falkenstein Mikrosysteme GmbH
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Chip on Board
Chip on bnoard production in our air-conditioned clean room:
Die-bonding
Wire-bonding
Dispensing of adhesives and Glob-Top
Multi-Point-Probe Measurement
Chip and Wire Bonding
Our range of products includes:
Thin-Wire-Bonding of Gold,Alu and Platin
Wedge-Wedge-.Bonding using "Delvotec" machinery
Ball-Wedge-Bonding using "Esec" machinery
Hand-Bonding for Wedge-Wedge and Ball-Wedge procedures
using machinery from Kulicke & Soffa
Bonding on thin-film and thick-film circuits
Bonding of Tray, Platform and Metal Can packages
Engineering
Circuit Design
Assembly & Packaging
Testing
Prototyping / Production
SMD Board assembly
Chip- on Board & Wire bonding
Projects
Aerospace Applications
Industrial Electronics
Research & Technology